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Fast 3D CT Machine VT-X750 CT AX With a resolution of 3um, automated X-ray inspection may separate a single solder junction into hundreds of cross-section slices for separate measurement and examination.
Hidden solder junctions are split into hundreds of cross-section slices in a matter of seconds using a high resolution 3D CT scan with the VT-X750. Individual layer isolation enables automated inspection methods to measure a range of features without interference or shadowing from components on the other side (such as Head-in-Pillow and voiding problems). Offline programming and repair software also enables users to make changes on the fly and lessens the need to halt operations.
| Item | Description | |||
|---|---|---|---|---|
| Model | VT-X750 | VT-X750-XL | ||
| Type | V3-H | V3-C | V2-H | |
| Inspection object | BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side terminal components, QFN, Power devices, POP, Press-fit CN, etc. | |||
| Inspection items | Void, open, non-wet, Solder volume, shifting, foreign object, bridging, Solder fillet, TH Solder filling, Solder ball, etc. (selectable to applications) | |||
| Imaging system | Method | 3D-slice imaging by using parallel CT | ||
| Resolution | 6, 8, 10, 15, 20, 25, 30um/pixel (selectable in the inspection program) | 3, 6, 8, 10, 15, 20, 25, 30um/pixel (selectable in the inspection program) | 10, 15, 20, 25, 30um/pixel (selectable in the inspection program) | |
| X-ray source | Micro-focus closed tube | |||
| X-ray detector | Flat panel detector | |||
| PCBA | Size | 50x50~610x515mm (2x2 to 24x20 inch), Thickness: 0.4~5.0mm (0.4~3.0mm in 3um resolution) | 100x50~1200x610mm, Thickness: 0.4~15.0mm | |
| Weight | Less than 4.0 kg, less than 8.0 kg (*option) | Less than 15kg | ||
| Component clearance Maximum | Top: 43mm (*90mm Option), Bottom: 40mm | Top: 40 mm, Bottom: 40 mm | ||
| Warpage | Less than 2.0 mm (Less than 1.0 mm in 3um resolution) | Less than 3.0 mm | ||
| Main body | Footprint | 1,550(W) x 1,925(D) x 1,645(H)mm | 2,180(W) x 2,510(D) x 1,735(H)mm | |
| Weight | Approx. 3,100kg | Approx. 5,350kg | ||
| Conveyor height | 900 ± 20 mm | |||
| Power supply | Single phase, 200 to 240 VAC, 50/60 Hz | |||
| Rated power | 2.4kVA | 2.58kVA | ||
| X-ray leakage | Less than 0.5 μSv/h | |||
| Air supply | 0.4 to 0.6 Mpa | |||
| Safety standard | CE, SEMI, NFPA, FDA | CE, SEMI, NFPA, FDA *Under Acquiring | ||
Models: High-speed automated X-ray CT inspection system VT-X750-V3.0-CR/VT-X750-V3.0-CV/VT-X750-V3.0-HR
| Model: | VT-X750-V3.0-CR | VT-X750-V3.0-CV | VT-X750-V3.0-HR |
|---|---|---|---|
| Technology | 3D CT | - | - |
| Resolution | 3um-30um | 3um-30um | 6um-30um |
| Board Handling | 50x50mm - 610x515mm | 50x50mm - 610x515mm | 50x50mm - 610x515mm |
| Board Weight | <4kg, <8kg | <4kg, <8kg | <4kg, <8kg |
| Detector Size | Large | Normal | Large |
Delivery information typically includes delivery times, shipping methods, packaging, etc., which may vary depending on the seller and purchase location.
